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| Customization: | Available |
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| Metal Coating: | Tin |
| Mode of Production: | SMT |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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SMT assembly | SMT Lines | 8 high-speed SMT lines |
Placement Speed | Up to 120,000 CPH | |
Component Range | 01005 ~ 55mm x 55mm | |
IC Package Types | QFP, BGA, QFN, CSP, WLCSP | |
Placement Accuracy | ±0.03mm | |
Solder Paste | Lead-free (RoHS compliant) / Leaded | |
Reflow Soldering | 8-zone / 10-zone reflow oven, ±1°C accuracy | |
Through-Hole Assembly | Wave Soldering | Lead-free wave soldering, PCB width up to 450mm |
Manual Insertion | Supported for special components | |
Selective Soldering | Nitrogen-protected, precise soldering | |
Testing & Inspection | AOI Inspection | Online AOI for solder paste & post-reflow |
X-Ray Inspection | 5-axis X-ray for BGA / QFN inspection | |
ICT (In-Circuit Test) | Flying probe / fixture-based ICT | |
FCT (Functional Test) | Customized functional test per customer spec | |
Burn-in Test | Temperature & load simulation available | |
PCBA Services | Design & Engineering | PCB layout, DFM / DFA optimization |
Reverse Engineering | Gerber / BOM / Schematic regeneration | |
Component Sourcing | Global sourcing, CKD / SKD kits | |
Enclosure Mold & Assembly | Plastic enclosure mold design & manufacturing | |
Conformal Coating | UV-curable / thermal-cure coating | |
Final Assembly | Box build / turnkey assembly | |
Base Material Type: | FR1, FR2, FR4, 22F, CEM1, CEM3, Aluminum, Copper core, Flexible Polyimide, Polyester, Ceramic etc. |
Max layer count: | 20 layers |
Surface treatment: | HASL, HASL lead free, ENIG, Immersion Ag, Immersion Tin, OSP, Golden finger, Gold plating, Selective ENIG,ENEPIG |
Thickness: | 0.4--3.5mm (Rigid board) 0.06~0.4mm (Flexible board) |
Tolerance (T≥1.0mm): | ± 10% |
Tolerance (T<1.0mm): | ±0.1mm |
Min track and spacing: | ≥3/3mil(0.076mm) |
Min network track and spacing: | ≥6mil/8mil(0.15/0.20mm) |
Min etching legend: | ≥8mil(0.20mm) |
Min BGA,Bolding pad: | ≥6mil(0.15mm) |
Outer layer copper: | 35--175um |
Inner layer copper | 17-70um |
Min hole(drilling machine) | 0.2mm |
Min hole(Laser) | 0.1mm |
Solarmask bridge | Green≥0.1mm Others≥0.12mm White/black≥0.15mm |
Min width of legend | 0.6mm |
Min height of legend | 0.8mm |
Max delivery size | 550mm x 560mm (multi-layer) 1500mm x 550mm (single/double layer) |






